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Strength of Lead-free BGA Spheres in High Speed Loading

Featured Article

Strength of Lead-free BGA Spheres in High Speed Loading

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection.

This paper reports the results of the measurement of the impact strength of lead-free 0.5�0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.

Credit/Source: Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura, Nihon Superior Co., Ltd.

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Placement Machine

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Heller: The Mark III Reflow System...

DEK: Galaxy Screen Printer...

Featured video

Lead Free SOT23 Installation
(3 min. 11 sec.)

Best, Inc instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.

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Forum

New Feature: you can now upload pictures with your postings. »»

Fuji feeder E-clips

Posted by Sr.Tech

Does anyone know of an after market source for the E-clips that hold the tape covers on CP and IP feeders... »»

Expired solder paste

Posted by AlexS

What would be some of the effects regarding assembly quality. Is there any changes in flux composition toward the end of shelf life?... »»

Used automatic stencil print recommendations

Posted by Comatose

We are a small OEM that runs a high mix/low volume environment. Typical runs are a couple or five hundred boards, one or two products per day... »»

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What happens to LPI Solder Mask on the RF4 PCB During Reflow?...

Auto Insertion multi purpose workboard holder...

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Boards: Get the Bare Facts on Bare Boards (inspection and fabrication)

Free Online Seminar/Course | EPTAC Corp.

Wed, April 16, 2008 | Online

You are probably aware of IPC-A-610 "Acceptability of Electronic Assemblies"(...) We take a look at IPC-A-600, IPC-6012 and other standards that can be crucial... »»

Signal Integrity & EMI Control in High Speed Circuits

Seminar/Course | Premier EDA Solutions Ltd.

Tue, April 15, 2008 | The Stone House Hotel, Stone, UK

The increase in switching speeds of modern digital electronics causes significant challenges for the PCB designer. In such cases, the physical interconnections... »»

12th Annual Atlanta SMTA Expo

Trade Show/Exhibition, Conference | SMTA

Thu, April 17, 2008 | Gwinnett Civic Center, Atlanta, GA, USA

This outstanding event will feature networking opportunities with leading suppliers to our industry, free technical sessions, raffle drawings and a complimentary lunch... »»

Extended PLC Troubleshooting Seminar...

SMT Processes Certification...

Lead-Free Academy...

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Industry Associations Events

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info

SMTA Certification for SMT Processes and Six Sigma Green Belt

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