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SMTnet Express, September 27, 2018, Subscribers: 31,354, Companies: 11,055, Users: 25,237

Technical Library

Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction

Carlos Tafoya, Gustavo Ramirez, Timothy O'Neill; AIM Solder

Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and ��� most notably ��� center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

Forum search results for related keywords: stencil aperture, BTC, voids,

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Nordson Asymtek

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SMT / PCB Equipment Auctions

Closure of Premier Surface Mount Facility - 2017 SMT Equipment

September 27 - 28 | X-Line Asset Management

Electronic Equipment Mart

BTU Pyramax 100A

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Juki KE 3020 (2017)

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DEK Horizon 03iX

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V-TEK Versacount SMD Counter

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Events Calendar

SMTA International 2018 Conference & Exhibition | October 14 - 18 | SMTA

High-Reliability Cleaning and Conformal Coating Conference | November 13 - 15 | IPC

PCB Cleaning Webinar Series | ZESTRON Corporation

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Industry Associations Events

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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

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IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

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Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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Selective Conformal Coating System - GPD impleCoat

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Unused Equipment? - let BajaBid turn your EXCESS ASSETS into cash!

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Hioki 1240 Flying Probe Tester - ultra-high speed measuring, fine pitch inspection.

Experience the Blackfox Difference - Premier IPC Training & Certification Center

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Innovative aqueous and solvent based technologies for cleaning PCBs

QWIKTRAY - custom component handling matrix tray - Count on Tools

Rework Made Easy - Guided processes with computer aided alignment and 3900W of power - Ersa HR 550 Rework Station

MIRTEC MV 6 OMNI High-Speed / High-Performance 3D AOI MACHINE.

Speedprint SP700avi inline SMT screen printer

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