Electronics Forum | Thu May 06 15:46:08 EDT 2004 | Automation Engineer
I am looking at putting in a 100,000+ cph assembly line capable of processing 8" X 8" boards. Mix is passsives down to 0402, 15 mil pitch flip chips. I would like to hear what comments you have on the new Assebleon AX, Fuji NXT, Siemens HS-60, Univ
Electronics Forum | Fri Jun 04 18:18:28 EDT 2004 | gabriele
Hi Ricardo, You should complete the question with more details like : - kind of components pkgs (Chips, SO,TSOP,QFP,BGA,CSP,etc) and % of them versus the total (400) - tech complexity of components (0402 ? Finest Lead and ball Pitch ? SMT conne
Electronics Forum | Mon Jun 07 14:47:22 EDT 2004 | Mark
It matters on how you setup your oven profile. I have placed J-leads on both sides with no problems. Also, have come across some fine pitch but wouldnt suggest this too often. Give some examples that he would like to see placed on the bottom side of
Electronics Forum | Sun Aug 01 21:17:52 EDT 2004 | Eric
I have already been working with GPD regarding this project but at the same time the stage of the project is still on the selection process so I'm still open to other machines to be qualified. As per current machine in house (Micromax II), we have
Electronics Forum | Tue Jul 27 06:08:18 EDT 2004 | C Lampron
Good Morning Everyone, Could someone please tell me what the acceptable range is for HASL plating thickness. We have some raw boards with plating thicknesses ranging from 3-4 mils on a fine pitch QFP. We are expeiencing bridging at this location an
Electronics Forum | Tue Jul 27 15:15:48 EDT 2004 | JSTARKEY
We have recently encountered a problem that we haven't seen before: The solder joint appears to be wetting ok and the solder is re-flowing but the appearance of the solder after re-flow is pitted. Using Kester 531, humidity around 41% temperature aro
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
Electronics Forum | Tue Aug 10 06:58:48 EDT 2004 | dka123
dear all, kindly guide me for the use of space electronics hardware assembky of PQFPs and Cqfps, how to form the flat pack leads, bend for 240 pins of 20 mil pitch and what are the Mil standards for them.how to cut the lead guards.can we use FP5 elit
Electronics Forum | Thu Sep 02 11:00:14 EDT 2004 | diderry
Hi Bryan, I hope you dont mind a quick sales pitch here. We have developed a system called HumiTel which is used to manage MSDs. Its not the paper tracking system you mentioned; it comes in two flavours, a hardware tracking device and a software whic
Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob
Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut
