Electronics Forum: placement off (Page 1 of 55)

Component placement

Electronics Forum | Thu Apr 11 11:06:27 EDT 2013 | ericrr

1) I think maybe not, however having said that, our conveyor does not work between the final placement machine and the oven, in the early days before I became a "experienced" operator in pulling the board out of machine running it along the track to

parts popping off during reflow

Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado

We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar

Fuji CP43 placement

Electronics Forum | Mon May 19 09:56:57 EDT 2008 | aj

all, The placement was off on one panel ( 4 up ) out of the batch. It was off by approx 1mm in the y-axis. No obvious faults found with machine. Any experience of such problem - I am guessing this is a sign of something wearing on the machine or s

Parts Blowing off in Reflow Oven

Electronics Forum | Wed Jun 29 17:56:47 EDT 2005 | Ryan

We have a new Heller 1809 EXL reflow oven and when we run MELF�s or Aluminum Electrolytic Capacitors through the oven they are being blown off the pads. I have verified that the placement is good before reflow. I verified that they are pushed down

Heller Oven blowing parts off reflowing

Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc

Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone

PLCC LED placement issues

Electronics Forum | Wed Nov 04 07:39:34 EST 2009 | vetteboy86

We have started using an RGB LED and today ran the first boards down our line. I noticed an immediate issue with placing these. I'm using a quad QSP-2. The part sticks to the nozzle. The nozzles are clean. I have adjusted machine handling so that vac

Re: SMT component placement

Electronics Forum | Thu Feb 04 21:17:41 EST 1999 | Chris G.

| What allowances are people using out there for components off-pad, we currently use 50% of lead width without breaking trace/component clearances but we have a customer demanding 25% allowance ? | IPC states: 50% off pad for class 1 and 2 25% off

PLCC LED placement issues

Electronics Forum | Wed Nov 04 10:28:04 EST 2009 | vetteboy86

Its been a while since I've worked with a QSP-2 > but I seem to remember that they should have a > puff off value where the machine will actually > blow the part off of the nozzle. I think it was > adjustable under the component handling but I >

PLCC LED placement issues

Electronics Forum | Wed Nov 04 10:31:25 EST 2009 | vetteboy86

I'm not familiar with a puff off setting. I have tried some different things including release delay to shut the vacuum off before the nozzle lifts in the upward direction. I tried to minimally overstroke the part hoping the paste tension would over

PLCC LED placement issues

Electronics Forum | Thu Nov 05 16:38:45 EST 2009 | rdoss

I don't recall where the puff off setting is either, but i know there is one. Find it and use that along with extending your pressing time. This will increase the time in which the nozzle holds the component in the solder. That, along with the puf

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