The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Published: |
June 21, 2012 |
Author: |
Richard Coyle, Richard Popowich, Peter Read, and Debra Fleming - Alcatel-Lucent, Raiyo Aspandiar, Alan Donaldson, Stephen Tisdale, and Vasu Vasudevan - Intel Corporation, Iulia Muntele, Robert Kinyanjui - Sanmina-SCI Corporation |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion... |
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