Solder Paste Stencil Design for Optimal QFN Yield and Reliability
Published: |
June 11, 2015 |
Author: |
B. Gumpert |
Abstract: |
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications. Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Lockheed Martin Corporation »
- Oct 04, 2022 - Counterfeit Materials Prevention
- Nov 19, 2015 - HALT Testing of Backward Soldered BGAs on a Military Product
- Oct 22, 2015 - Tin Whisker Risk Management by Conformal Coating
- See all SMT / PCB technical articles from Lockheed Martin Corporation »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Solder Paste Stencil Design for Optimal QFN Yield and Reliability article has been viewed 1027 times