Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Published: |
November 7, 2018 |
Author: |
Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert |
Abstract: |
Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications. We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously.... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards article has been viewed 866 times
