Wedge Bonding Tool Selection

Published:

May 23, 2019

Author:

ACI Technologies, Inc.

Abstract:

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1....

  • Download Wedge Bonding Tool Selection article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant / Service Provider, Standards Setting / Certification, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

See Company Website »

Company Postings:

(24) products in the catalog

(1) upcoming training course

(64) technical library articles

(2) news releases

  • Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
  • Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
  • Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
  • Mar 19, 2024 - What is Underfill | GPD Global
  • Browse Technical Library »

Wedge Bonding Tool Selection article has been viewed 650 times

Win Source Online Electronic parts

Void Free Reflow Soldering