Qualification Test Development for Creep Corrosion

Published:

April 8, 2021

Author:

Prabjit Singh Simon Lee

Abstract:

Creep corrosion is not a new phenomenon, it has become more prevalent since the enactment of the European Union's Restriction of Hazardous Substance (RoHS) Directive on 1 July 2006. The directive bans the use of lead and other hazardous substances in products (where lead-based surface finishes offered excellent corrosion resistance). The higher melting temperatures of the lead-free solders and their poor wetting of copper metallization on PCBs forced changes to PCB laminates, surface finishes and processing temperature-time profiles. As a result, printed circuit boards might have higher risk of creep corrosion....

  • Download Qualification Test Development for Creep Corrosion article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

iNEMI is an industry-led consortium focused on identifying and closing technology gaps, which includes the development and integration of the electronics industry supply infrastructure.

Herndon, Virginia, USA

  • Phone 703-834-0330
  • Fax 703-834-2735

See Company Website »

Company Postings:

(10) technical library articles

(23) news releases

  • Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
  • Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
  • Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
  • Mar 19, 2024 - What is Underfill | GPD Global
  • Browse Technical Library »

Qualification Test Development for Creep Corrosion article has been viewed 618 times

See Your 2024 IPC Certification Training Schedule for Eptac