Reliability of PWB Microvias for High Density Package Assembly
Published: |
December 21, 2021 |
Author: |
Reza Ghaffarian, Ph.D. |
Abstract: |
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.... |
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