ALD Atomic Layer Deposition for space applications

ALD – Atomic Layer Deposition

- Is a batch coating process with surface chemistry
- Wide range of material, e.g. Al2O3, TiO2, M-, M-C,M-N
- Typical; 100 nm up to ~0,5 μm
- True 3D down to nanopores, no pinholes
- Vacuum deposition process
-- Substrates are degassed & heated (degas analyzed)
-- ~40 C – 125C – 400 C
- Mature IC manufacturing process
- Extremely repeatable in thickness & quality over time
- Chemically adhesion; will not peal off/flak
-- Dense,
-- Pinhole- and defect-free films
-- Digitally repeatable process