MODERN 2D / 3D X-RAY INSPECTION -- EMPHASIS ON BGA, QFN, 3D PACKAGES, AND COUNTERFEIT COMPONENTS
Published: |
November 20, 2023 |
Author: |
Evstatin Krastev and David Bernard |
Abstract: |
With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and dense packages have more opportunities to exhibit defects both internal to the package as well as to the PCB. As components increase in complexity their cost increases, making counterfeiting them a potentially lucrative business for unscrupulous individuals and organizations.... |
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