CORRELATION BETWEEN CALCULATION AND PRACTICE FOR SIMPLE TOP-TO-BOTTOM PCB HEAT DISSIPATION USING TIM & VIAS
Published: |
July 24, 2024 |
Author: |
Andreas Nadler, Markus Eberle |
Abstract: |
A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have The thickness of a TIM is often more critical than the thermal conductivity of the material The thermal resistance of the surface between the materials are most critical Better use many small vias than a few big vias! Plated or filled vias are very expensive to get, better try to stay with standard!... |
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