Placement Optimisation in a Lean Manufacturing Environment
Published: |
February 20, 2008 |
Author: |
Pierre Chatain, Europlacer Limited, Dorset, UK |
Abstract: |
Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.... |
|
More SMT / PCB assembly technical articles »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
- Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
- Browse Technical Library »
Placement Optimisation in a Lean Manufacturing Environment article has been viewed 673 times