Placement Optimisation in a Lean Manufacturing Environment

Published:

February 20, 2008

Author:

Pierre Chatain, Europlacer Limited, Dorset, UK

Abstract:

Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques....

  • Download Placement Optimisation in a Lean Manufacturing Environment article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

EUROPLACER

Europlacer designs and manufactures a comprehensive range of highly flexible SMT pick and place equipment for the global electronics industry, with a network of distributors across the globe.

Poole Dorset, United Kingdom

Manufacturer of Assembly Equipment, Pick and Place

  • Phone +44 1202 266600
  • Fax +44 1202 266599

EUROPLACER website

Company Postings:

(9) products in the catalog

(1) technical library article

(182) news releases

  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Placement Optimisation in a Lean Manufacturing Environment article has been viewed 832 times

Surface Insulation Resistance

Voidless Reflow Soldering