Solving the ENIG Black Pad Problem: An ITRI Report on Round 2
Published: |
January 17, 2013 |
Author: |
F.D.Bruce Houghton |
Abstract: |
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Celestica Corporation »
- Feb 13, 2023 - Whisker Formation Induced by Component and Assembly Ionic Contamination
- Oct 11, 2022 - MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES
- Sep 08, 2021 - The Great SAC Debate: Comparing The Reliability Of SAC305 And SAC405 Solders In A Variety Of Applications
- Feb 28, 2018 - Deposition of Solder Paste into High Density Cavity Assemblies
- Aug 20, 2015 - Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
- See all SMT / PCB technical articles from Celestica Corporation »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Solving the ENIG Black Pad Problem: An ITRI Report on Round 2 article has been viewed 1097 times