Stencil Design Guidelines for Electronics Assembly Technologies.
Published: |
March 13, 2014 |
Author: |
Budapest University of Technology and Economics Department of Electronics Technology |
Abstract: |
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.... |
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