• SMTnet
  • »
  • Technical Library
  • »
  • Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method

Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method

Published:

August 15, 2018

Author:

Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi

Abstract:

Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method....

  • Download Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

JX Nippon Mining & Metals

JX Nippon engages in the development of non-ferrous metals that include copper, gold, and silver. It also manufactures electro-deposited and treated rolled copper foils that are used in PCBs.

Tokyo, Japan

Manufacturer of Assembly Material

  • Phone 81 3 5299 7000

JX Nippon Mining & Metals website

Company Postings:

(1) technical library article

  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Apr 27, 2018 - Hot Air vs. IR BGA Rework Stations | Precision PCB Services, Inc
  • Feb 22, 2018 - Hand Soldering with Lead Free Alloys | Metcal
  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
  • Browse Technical Library »

Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method article has been viewed 179 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method
StikNPeel™ Rework Stencils

PCB Assembly Equipment Auctions