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Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method

Published:

August 15, 2018

Author:

Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi

Abstract:

Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method....

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Company Information:

JX Nippon Mining & Metals

JX Nippon engages in the development of non-ferrous metals that include copper, gold, and silver. It also manufactures electro-deposited and treated rolled copper foils that are used in PCBs.

Tokyo, Japan

Manufacturer of Assembly Material

  • Phone 81 3 5299 7000

JX Nippon Mining & Metals website

Company Postings:

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