Temperature Cycling and Fatigue in Electronics

Published:

January 1, 2020

Author:

Gilad Sharon, Ph.D., Greg Caswell

Abstract:

The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.

CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating....

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Company Information:

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

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  • Phone 301 474-0607
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