Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications
Published: |
January 17, 2023 |
Author: |
Yue Deng, Xike Zhao, Liang He, David Wright, Hossein Madanipour, Bret Halbe, Jung Kyu, Fred Tarazi, Gang Duan, Dror Trifon, Rahul Manepalli, David Heller |
Abstract: |
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Heller Industries Inc. »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow
- Jan 17, 2023 - The User Benefits of a Supplier Partnership
- Jan 17, 2023 - Flux Management
- Jan 17, 2023 - Function and Operational Theory of Condenser Tube Flux Collection System
- See all SMT / PCB technical articles from Heller Industries Inc. »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications article has been viewed 614 times