Influence of Plating Quality on Reliability of Microvias
Published: |
May 12, 2016 |
Author: |
Yan Ning, Michael H. Azarian, Michael Pecht |
Abstract: |
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue. ... |
You must be a registered user to talk back to us. |
Company Information:
More articles from CALCE Center for Advanced Life Cycle Engineering »
- Dec 05, 2022 - No-fault-found and intermittent failures in electronic products
- Oct 31, 2022 - Microstructure and Intermetallic Formation in SnAgCu BGA Components Attached With SnPb Solder Under Isothermal Aging
- Jan 26, 2022 - Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
- Dec 21, 2021 - Using Simulation to Optimize Microvia Placement and Materials to Avoid Failure During Reflow
- Dec 16, 2021 - Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
- See all SMT / PCB technical articles from CALCE Center for Advanced Life Cycle Engineering »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Influence of Plating Quality on Reliability of Microvias article has been viewed 972 times