Defect freeQFN Assembly

Published:

June 9, 2011

Author:

Brian J. Leach

Abstract:

QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and...

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Company Information:

Highly specialized, difficult to build electronic assemblies. Medium to low volume.

McKean, Pennsylvania, USA

Manufacturer

  • Phone 814-476-1258
  • Fax 814-476-7933

See Company Website »

Company Postings:

(4) products in the catalog

(1) technical library article

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