Organic Flip Chip Packages for Use in Military and Aerospace Applications
Published: |
November 14, 2006 |
Author: |
David Alcoe, Kim Blackwell and Irving Memis, Endicott NY |
Abstract: |
Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ... |
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