Organic Flip Chip Packages for Use in Military and Aerospace Applications

Published:

November 14, 2006

Author:

David Alcoe, Kim Blackwell and Irving Memis, Endicott NY

Abstract:

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package ...

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Company Information:

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Assembly, Component Packaging, Contract Manufacturer, Manufacturer of Assembled PCBs, Manufacturer of Bare PCBs

  • Phone 866 820-4820
  • Fax 607 755-7000

i3 Electronics website

Company Postings:

(3) products in the catalog

(20) technical library articles

(26) news releases

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