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SMT Express, Volume 5, Issue No. 4 - from
Get Ready For NEPCON
NEPCON East/Electro & Assembly East is converging this summer in Boston on June 9, 10 & 11 at the Bayside Expo & Conference Center. A production of Reed Exhibitions, this show brings all the prime suppliers under one roof. Establish and renew business relations through person-to-person networking. The Nepcon program provides breakthrough technology sessions organized by SMTA, IEEE and the ESD. The Assembly East program includes top-level sessions featuring SME, EWI, AWS and MassMEP presentations.
Learn More About NEPCON East
SMTnet Express Increases Publication
Beginning in April, the SMTnet Express will be published bi-monthly on the 2nd and 4th Wednesday of each month. The Express delivers useful and timely business and technical news from the electronic manufacturing community as well as links to leading technical writers. Share the Express with a colleague and send us your comments. We welcome your feedback at SMTnet.
Sanmina-SCI Assumes Environmental Leadership
Sanmina advances lead free processes
Teradyne Recognized at APEX
Teradyne receives two Service Excellence Awards
Amkor First Quarter Earnings
Amkor will webcast conference call on first quarter earnings
Sparton Selected By Motorola
Sparton becomes member of Motorola Design Alliance Program
NEPCON East/Electro Increases Offerings
NEPCON beefs up educational & training sessions at Boston show
Celestica Chooses Agilent 5DX Series
Agilent chosen to provide new automated x-ray test system
Spatial Announces New Partner
Spatial Announces GiveMePower Corporation As ACIS Enabled Partner
Park Electrochemical Announces Closure
Closure of Dielektra's Mass Lamination Operation

Agilent Elevates AOI Technology
Agilent revolutionizes AOI with 3D Solid Shape Modeling technology
Anadigm Simplifies Analog Design
Anadigm's FPAA intended for wide range of analog design applications
Parvus launches Biothenticator���
Parvus' finger print sensor creates new PCB application
Vision Engineering Systems
Vision Engineering's stereo optical inspection systems tackles lead-free issues
Metcal promotes Optical Inspection
Metcal's innovative VPI-1000 raises the bar on pcb optical inspection systems
GTK Eliminates Soldering
GTK's press-fit D-subs fit on PCBs without need for soldering
Cookson Advances MicroDot Technology
Cookson's CAMALOT XyflexPro MicroDot dispensing process points the way
Tecnomatix Builds on eM Technology
Tecnomatix eM-Assembly Expert 2.0 enhances family of MPM products.
More News

BGA Rework
Posted by Chrissie

We've encountered a little problem with BGA's...

Cracked ceramic chip capacitors.
Posted by dst

My company is currently experiencing a high feild failure rate on a 100nF chip ceramic...

BGA Picture Evaluation
Posted by Kevin Facinelli

I am tuning a BGA process for a board assembly and would like to know if someone with a depth of experience can look at some Ersa Scope picture I can email out.

Visit the Forum
Universal Instruments Ethernet Controller
Posted by EED,llc
Fuji QP-242E
Posted by Fastek International LLC
Heller 1500W
Posted by A C Tech
Visit the Mart

May 6 - 8, 2003
Del Mar Electronics Show
May 7 -8, 2003
ESDiscovery USA
May 20, 2003
NEPCON East and Electro 2003
June 9 - 11, 2003
Visit the Calendar

Evaluation Update
Lead-Free Wave Soldering
From Circuits Assmbly
Obsolete Circuit Board Inventory
Strategies for Recapturing Obsolete Inventory
From CircuiTree
Enhancing Assembly Traceability
Laser Marking Enhances Assembly Traceability
From SMT Magazine
Microfocus X-ray Inspection
More than counting black dots
From TKB-4U

Exhibit At ATExpo

During SMTA International
SMTA Wants You

SMTA Seeking Board of Directors
SMTA Beantown Bonanza

SMTA Boston Academy and Flip Chip & BGA Workshop
SMTA Exhibit Opportunities for 2003

SMTA chapters announce upcoming vendor shows

IPC, SOLDERTEC Sponsor International Conference

IPC, SOLDERTEC to Address Hot Lead Free Topics
IPC 2003 Spring TMRC Options

IPC develops virtual and actual 2003 Spring TMRC Conference
April Lead-Free Conference

IPC and JEDEC hold annual lead-free conference
SMTnet Express is a bi-monthly publication of
Direct inquiries and comments to SMTnet tel: 207-780-0887
Volume 5, Issue No. 4 April 10, 2003
High Throughput Reflow Oven
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB
Concept2market online late model Electronic Assembly Equipment Auction My data Feeders

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