Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any
electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs
must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve
signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df)
build-up materials that enables the manufacture of ultra-fine circuitry. (...)
This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100
nm) and excellent adhesion (610-680 gf/cm) at various processing conditions...
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.